1. Moulding Technology
Dry Pressing: Tsim nyog rau qhov yooj yim -zoo li tus, tus nqi qis tab sis txwv qhov tseeb.
Txhaj Moulding: tuaj yeem tsim cov qauv tsim, xws li cov iav me me, yuav tsum muaj cov ntaub ntawv loj.
Casting: Siv los tsim ultra-thin ceramic substrates (thickness<0.1mm).
2. Cov txheej txheem sintering
Atmospheric Pressure Sintering: High economic efficiency, tab sis tsawg ntom.
Hot Isostatic Pressing (HIP): Improves material density through a high-pressure argon environment, achieving performance close to theoretical values.
3. Precision Machining Technology
Pob zeb diamond sib tsoo: Siv lub pob zeb diamond log rau machining tiaj tus lossis nkhaus, nrog qhov tseeb txog li ± 1μm.
Laser Machining: Femtosecond lasers tuaj yeem ua tiav micron-theem drilling, siv los ntawm - qhov tsim nyob rau hauv ceramic circuit boards.
Ultrasonic Machining: Siv siab- zaus vibration kom tawg cov ntaub ntawv, haum rau machining brittle ceramics xws li zirconia.
4. Kev kho deg
Chemical Mechanical Polishing (CMP): Siv rau nanoscale planarization ntawm semiconductor ceramic substrate nto.
Txheej thev naus laus zis: Tso TiN txheej rau ntawm lub cuab yeej los txhim kho kev hnav tsis kam.